The UFC23 marks the company’s fourth-generation solution in this field and is designed to meet growing demand for precise ...

New research from TrendForce shows that the DDR4 market remains in a persistent state of undersupply and has continued to see strong price growth through 2H25. Shortages drive up memory prices ...

binder has launched a new hybrid connector designed to support “One Cable Automation” systems, combining power supply and ...

Imec has announced that its ASIC and silicon photonics services division, IC‑Link, has joined TSMC’s 3DFabric Alliance.

ROLEC unveils range of diecast aluminium enclosures designed to protect in‑cab human-machine interface (HMI) systems.

TDK has launched a new series of non-isolated DC-DC converters designed for industrial and battery powered applications.

Under chatbot-based architectures, the typical CPU-to-GPU ratio ranged from 1:4 to 1:8. With agentic AI, this is shifting ...

Greg Robinson, corporate vice president at Microchip, added that the launch reflects a broader strategy to expand its ...

Emerson has announced plans to extend its artificial intelligence capabilities across its test and measurement software.

ByteSnap Design has introduced an online tool designed to help developers evaluate embedded project feasibility.

Anglia Components has entered into a pan-European authorised distribution agreement with Same Sky, extending its product ...

SK Hynix said to be receiving offers from global technology companies to invest in its semiconductor production line.